NEC N8101-732F Datenblatt PDF herunterladen (Seite 198)

Intel® Xeon® Processor E5-2400 v2 Product Family 198

Datasheet Volume One

Package Mechanical Specifications

9.2 Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component

keep-out zone requirements. A thermal and mechanical solution design must not

intrude into the required keep-out zones. Do not contact the Test Pad Area with

conductive material. Decoupling capacitors are typically mounted to either the topside

or land-side of the package substrate. See Figure 9-2 through Figure 9-3 for keep-out

zones. The location and quantity of package capacitors may change due to

manufacturing efficiencies but will remain within the component keep-in.

9.3 Package Loading Specifications

Table 9-1 provides load specifications for the processor package. These maximum

limits should not be exceeded during heatsink assembly, shipping conditions, or

standard use condition. Exceeding these limits during test may result in component

failure. The processor substrate should not be used as a mechanical reference or load-

bearing surface for thermal solutions.

Notes:

1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

2. This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism

(ILM).

3. These specifications are based on limited testing for design characterization. Loading limits are for the

package constrained by the limits of the processor socket.

4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load

requirement.

5. See Intel® Xeon® Processor E5-2400 v2 Product Family Thermal/Mechanical Design Guide (TMDG) for

minimum socket load to engage processor within socket.

9.4 Package Handling Guidelines

Table 9-2 includes a list of guidelines on package handling in terms of recommended

maximum loading on the processor IHS relative to a fixed substrate. These package

handling loads may be experienced during heatsink removal.

9.5 Package Insertion Specifications

The processor can be inserted into and removed from an 1356 socket 15 times. The

socket should meet the 1356 requirements detailed in the

Intel® Xeon® Processor E5-

2400 v2 Product Family Thermal/Mechanical Design Guide (TMDG)

Table 9-1. Processor Loading Specifications

Parameter Maximum Notes

Static Compressive Load 890 N [200 lbf] 1, 2, 3, 5

Dynamic Load 1779 N [400lbf] [max static compressive + dynamic load] 1, 3, 4, 5

Table 9-2. Package Handling Guidelines

Parameter Maximum Recommended Notes

Shear 70 lbs

Tensile 25 lbs

Torque 35 in.lbs

1 2 ... 193 194 195 196 197 198 199 200 201 202 203 ... 215 216

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