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User’s Manual U12978EJ3V0UD

220

CHAPTER 18 RECOMMENDED SOLDERING CONDITIONS

The

PD789800 Subseries should be soldered and mounted under the following recommended conditions.

For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

Table 18-1. Surface Mounting Type Soldering Conditions

µµ

PD789800GB-×××

××××××

×××-8ES: 44-pin plastic LQFP (10 ×

××

× 10)

µµ

PD78F9801GB-8ES: 44-pin plastic LQFP (10 ×

××

× 10)

Soldering Method Soldering Conditions Symbol

Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),

Count: Twice or less

IR35-00-2

VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200 °C or higher),

Count: Twice or less

VP15-00-2

Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,

Preheating temperature: 120°C max. (package surface temperature)

WS60-00-1

Partial heating method Pin temperature: 300°C max. Time: 3 seconds max. (per pin row) −

Caution Do not use different soldering methods together (except for partial heating).

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